Packaging Assistance
With over thirty years of combined package engineering experience in organics and ceramics, TestEdge can provide technical support for bringing your chip, package, and assembly together. We are committed to meeting and exceeding your requirements, from R&D to production. We can supply:

  • Package selection
  • Traditional & stud wafer bumping interface
  • Cost, performance & thermal tradeoffs
  • Die pad, wire bond, & flip chip constraints
  • Production feasibility studies
  • Off-shore and domestic production interface
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